features ? dual channel optocoupler convenient plastic soic-8 surface mountable package style two channels in one compact surface mount package closely matched current transfer ratios to minimize unit-to-unit variation minimum v (br)ceo of 70 volts guaranteed standard soic-8 footprint, with 0.050? lead spacing compatible with dual wave, vapor phase and ir reflow soldering high input-output isolation of 2500 vac (rms) guaranteed meets u.l. regulatory requirements, file #e90700, volume 2 absolute maximum ratings (t a = 25c unless otherwise specified) description the mocd207m/mocd208m consist of two silicon phototransistors optically coupled to two gaas infrared leds. these devices are constructed in a small outline surface mount package which conforms to the standard soic-8 footprint. rating symbol value unit emitter i f 60 ma forward current - continuous forward current - peak (pw = 100 s, 120 pps) i f (pk) 1.0 a reverse voltage v r 6.0 v led power dissipation @ t a = 25c p d 90 mw derate above 25c 0.8 mw/c detector v ceo 70 v collector-emitter voltage collector-base voltage v cbo 70 v emitter-collector voltage v eco 7.0 v collector current-continuous i c 150 ma detector power dissipation @ t a = 25c p d 150 mw derate above 25c 1.76 mw/c total device input-output isolation voltage (1,2) v iso 2500 vac(rms) (f = 60 hz, 1 min. duration) total device power dissipation @ t a = 25c p d 250 mw derate above 25c 2.94 mw/c ambient operating temperature range t a -45 to +100 c storage temperature range t stg -45 to +125 c lead soldering temperature t l 260 c (1/16? from case, 10 sec. duration) mocd207m mocd208m emitter 1 collector 1 anode 1 cathode 1 1 2 3 4 5 6 7 8 emitter 2 collector 2 anode 2 cathode 2 dual channel phototransistor small outline surface mount optocouplers ? ? 2001 fairchild semiconductor corporation ds300270 12/19/01 1 of 6 www.fairchildsemi.com applications feedback control circuits interfacing and coupling systems of different potentials and impedances general purpose switching circuits monitor and detection circuits
parameter test conditions symbol device min typ** max unit emitter i f = 30 ma v f all ? 1.25 1.55 v input forward voltage reverse leakage current v r = 6.0 v i r all ? 0.001 100 a capacitance c all ? 18 ? pf detector collector-emitter dark current v ce = 10 v, t a = 25 ci ceo all ? 1.0 50 na v ce = 10 v, t a = 100 ci ceo all ? 1.0 ? a collector-emitter breakdown voltage i c = 100 av (br)ceo all 70 100 ? v emitter-collector breakdown voltage i e = 100 av (br)eco all 7.0 10 ? v collector-emitter capacitance f = 1.0 mhz, v ce = 0 v c ce all ? 7.0 ? pf coupled i f = 10 ma, v ce = 5 v mocd207 100 150 200 current transfer ratio, ctr mocd208 40 ? 125 collector to emitter (4) i f = 1 ma, v ce = 5 v mocd207 34 ?? % mocd208 13 ?? collector-emitter saturation voltage i c = 2.0 ma, i f = 10 ma v ce (sat) all ? ? 0.4 v turn-on time i c = 2.0 ma, v cc = 10 v, r l = 100 ? t on all ? 3.0 ? s turn-off time i c = 2.0 ma, v cc = 10 v, r l = 100 ? t off all ? 2.8 ? s rise time i c = 2.0 ma, v cc = 10 v, r l = 100 ? t r all ? 1.6 ? s fall time i c = 2.0 ma, v cc = 10 v, r l = 100 ? t f all ? 2.2 ? s isolation surge voltage (1,2) f = 60 hz, t = 1 min. v iso all 2500 ?? vac(rms) isolation resistance (2) v i-o = 500 v r iso all 10 11 ?? ! isolation capacitance (2) v i-o = 0 v, f = 1 mhz c iso all ? 0.2 ? pf electrical characteristics (t a = 25 c unless otherwise specified) (3) note: 1. input-output isolation voltage, v iso , is an internal device dielectric breakdown rating. 2. for this test, pins 1, 2, 3 and 4 are common and pins 5, 6, 7 and 8 are common. 3. always design to the specified minimum/maximum electrical limits (where applicable). 4. current transfer ratio (ctr) = i c /i f x 100%. www.fairchildsemi.com 2 of 6 12/19/01 ds300270 ** typical values at t a = 25 c mocd207m mocd208m dual channel phototransistor small outline surface mount optocouplers
ds300270 12/19/01 3 of 6 www.fairchildsemi.com fig. 2 output curent vs. input current i f - led input current (ma) 0.1 1 10 100 i c - output collector current (normalized) 0.01 0.1 1 10 v ce = 5v normalized to i f = 10 ma fig. 3 output current vs. ambient temperature t a - ambient temperature ( o c) -80 -60 -40 -20 0 20 40 60 80 100 120 i c - output collector current (normalized) 0.1 1 10 normalized to t a = 25 o c fig. 4 output current vs. collector - emitter voltage v ce - collector -emitter voltage (v) 012345678910 i c - output collector current (normalized) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 i f = 10 ma norm alized to v ce = 5v fig. 5 dark current vs. ambient temperature t a - ambient temperature ( o c) 020406080100 i ceo - collector -emitter dark current (na) 0.1 1 10 100 1000 10000 v ce =10v i f - led forward current (ma) v f - forward voltage (v) fig. 1 led forward voltage vs. forward current 1 10 100 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 t a = 55 c t a = 25 c t a = 100 c mocd207m mocd208m dual channel phototransistor small outline surface mount optocouplers
package dimensions (surface mount) lead coplanarity : 0.004 (0.10) max 0.202 (5.13) 0.182 (4.63) 0.021 (0.53) 0.011 (0.28) 0.050 (1.27) typ 0.244 (6.19) 0.224 (5.69) 0.143 (3.63) 0.123 (3.13) 0.008 (0.20) 0.003 (0.08) 0.010 (0.25) 0.006 (0.16) seating plane 0.164 (4.16) 0.144 (3.66) 0.019 [0.48] pin 1 www.fairchildsemi.com 4 of 6 12/19/01 ds300270 mocd207m mocd208m dual channel phototransistor small outline surface mount optocouplers
4.0 0.10 ? 1.5 min user direction of feed 2.0 0.05 1.75 0.10 5.5 0.05 12.0 0.3 8.0 0.10 0.30 max 8.3 0.10 3.50 0.20 0.1 max 6.40 0.20 5.20 0.20 ? 1.5 0.1/-0 qt carrier tape specifications (?d? taping orientation) r1 r1 tape and reel (500 units per reel) r2 r2 tape and reel (2500 units per reel) order entry option identifier description ordering information ds300270 12/19/01 5 of 6 www.fairchildsemi.com mocd207m mocd208m dual channel phototransistor small outline surface mount optocouplers
8-pin small outline 0.024 (0.61) 0.050 (1.27) 0.155 (3.94) 0.275 (6.99) 0.060 (1.52)
marking information re?ow protle 1 2 6 4 3 5 detnitions 1 fairchild logo 2 device number 3 vde mark (note: only appears on parts ordered with vde option e see order entry table) 4 one digit year code, e.g., ?3? 5 two digit work week ranging from ?01? to ?53? 6 assembly package code d207 s yy x v ramp up = 2 e 10 c/sec peak reflow temperature: 245 c (package surface temperature) time of temperature higher than 183 c for 120 e 180 seconds one time soldering reflow is recommended 230 c, 10 e 30 s time (minute) 0 300 250 200 150 100 50 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 temperature ( c) time above 183 c, 120 e 180 sec 245 c peak
disclaimer fairchild semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. fairchild does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. trademarks the following are registered and unregistered trademarks fairchild semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. life support policy fairchild?s products are not authorized for use as critical components in life support devices or systems without the express written approval of fairchild semiconductor corporation. as used herein: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. product status definitions definition of terms datasheet identification product status definition advance information preliminary no identification needed obsolete this datasheet contains the design specifications for product development. specifications may change in any manner without notice. this datasheet contains preliminary data, and supplementary data will be published at a later date. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. this datasheet contains final specifications. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. this datasheet contains specifications on a product that has been discontinued by fairchild semiconductor. the datasheet is printed for reference information only. formative or in design first production full production not in production isoplanar? littlefet? microcoupler? microfet? micropak? microwire? msx? msxpro? ocx? ocxpro? optologic ? optoplanar? pacman? pop? fast ? fastr? fps? frfet? globaloptoisolator? gto? hisec? i 2 c? i-lo ? implieddisconnect? rev. i13 acex? activearray? bottomless? coolfet? crossvolt ? dome? ecospark? e 2 cmos? ensigna? fact? fact quiet series? power247? poweredge? powersaver? powertrench ? qfet ? qs? qt optoelectronics? quiet series? rapidconfigure? rapidconnect? serdes? silent switcher ? smart start? spm? stealth? superfet? supersot?-3 supersot?-6 supersot?-8 syncfet? tinylogic ? tinyopto? trutranslation? uhc? ultrafet ? vcx? across the board. around the world.? the power franchise ? programmable active droop?
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